Vinelectronics has stayed on the leading edge of printed circuit board assembly (pcba) and subsystems manufacturing by utilizing the most advanced assembly technologies and processes available. From high-volume, low-complexity boards to low-volume, highly complex backplanes, our production sites worldwide stay ahead of the competition by continuously improving upon and installing new assembly capabilities and manufacturing processes.
We work with our customers and suppliers to anticipate technology trends and qualify assembly methods for new component packages, such as high I/o count ball grid arrays (bgas) and other products. And we develop manufacturing techniques that solve our customers' unique supply chain problems. Currently, we are at the forefront in developing lead-free manufacturing techniques to help our customers comply with new environmental regulations banning lead solder in electronics products.
And because we use common assembly systems and processes at all of our factories worldwide from solder paste and placement equipment to inventory management we can quickly and easily transfer production whenever and wherever our customers and their markets require it. Our customers are global, but their markets differ regionally and even locally. As a result, when it comes to our global footprint, one factor rules: We locate facilities and capabilities where we competitively add the most value for our customers.
Our goal is to deliver the lowest landed cost, including logistics, shipping, production and opportunity costs associated with reliability and time-to-market. That's why we have a range of production capabilities in Asia, Europe and the americas. It's why we utilize large facilities that provide volume efficiencies, and smaller sites focused on specific skills. For example, we assemble highly complex products near our customers' end-markets often integrating circuit boards and subsystems manufactured in cost-competitive regions to ensure the most cost-effective manufacturing solution.
To us, global means serving our customers in an integrated and coordinated way. This approach enables us to execute with greater precision, economic leverage and flexibility to provide integrated supply chain services that deliver the best value to our customers
Our services are: -
-------------------------
Materials procurement
Supply chain logistics and inventory management
Engineering & design services
PCB lay out designing
PCB fabrication
PC board assembly
Both side components
Fine pitch surface mount, including 0402's
Bga, micro bga and fpga
Through hole and mixed technology
Power converter manufacturing
Functional testing
Conformal coating
Burn in and thermal stress testing services
Box build assembly - sheet metal and plastic injection
Full systems integration
Final packaging with directs shipment to the end customer
Consignment & turnkey
We work with our customers and suppliers to anticipate technology trends and qualify assembly methods for new component packages, such as high I/o count ball grid arrays (bgas) and other products. And we develop manufacturing techniques that solve our customers' unique supply chain problems. Currently, we are at the forefront in developing lead-free manufacturing techniques to help our customers comply with new environmental regulations banning lead solder in electronics products.
And because we use common assembly systems and processes at all of our factories worldwide from solder paste and placement equipment to inventory management we can quickly and easily transfer production whenever and wherever our customers and their markets require it. Our customers are global, but their markets differ regionally and even locally. As a result, when it comes to our global footprint, one factor rules: We locate facilities and capabilities where we competitively add the most value for our customers.
Our goal is to deliver the lowest landed cost, including logistics, shipping, production and opportunity costs associated with reliability and time-to-market. That's why we have a range of production capabilities in Asia, Europe and the americas. It's why we utilize large facilities that provide volume efficiencies, and smaller sites focused on specific skills. For example, we assemble highly complex products near our customers' end-markets often integrating circuit boards and subsystems manufactured in cost-competitive regions to ensure the most cost-effective manufacturing solution.
To us, global means serving our customers in an integrated and coordinated way. This approach enables us to execute with greater precision, economic leverage and flexibility to provide integrated supply chain services that deliver the best value to our customers
Our services are: -
-------------------------
Materials procurement
Supply chain logistics and inventory management
Engineering & design services
PCB lay out designing
PCB fabrication
PC board assembly
Both side components
Fine pitch surface mount, including 0402's
Bga, micro bga and fpga
Through hole and mixed technology
Power converter manufacturing
Functional testing
Conformal coating
Burn in and thermal stress testing services
Box build assembly - sheet metal and plastic injection
Full systems integration
Final packaging with directs shipment to the end customer
Consignment & turnkey
| Company Name | Vin Electronics |
|---|---|
| Business Type | Manufacturer |
| Main Products | PCB, PCB design, PCB fabrication, component assembly, box building |
| Total No. Employees | 501 - 1000 People |
| City | Mysore |
| Province/State | Karnataka |
| Country/Region | India |
| Contact Person | Mr. Dileep K |
| Telephone | 9************0 View all, please login |
| Mobile | 9***********0 View all, please login |
| Fax | 91-821-5287416 |
| Street Address | Hebbal Industuial Area |
| Zip Code | 570016 |
| sell123 URL | http://www.sell123.org/company/India/1127962.htm |
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